Issued Patents All Time
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang +7 more | 2014-11-11 |
| 8846448 | Warpage control in a package-on-package structure | Meng-Tse Chen, Wei-Hung Lin, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng +1 more | 2014-09-30 |
| 8809117 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2014-08-19 |
| 8702871 | Package assembly cleaning process using vaporized solvent | Yi-Li Hsiao, Bor-Ping Jang, Lin-Wei Wang, Chien Ling Hwang, Chung-Shi Liu | 2014-04-22 |
| 8616433 | Forming low stress joints using thermal compress bonding | Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu | 2013-12-31 |
| 8609462 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2013-12-17 |
| 8603860 | Process for forming packages | Meng-Tse Chen, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2013-12-10 |
| 8586408 | Contact and method of formation | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2013-11-19 |
| 8556158 | Thermal compress bonding | Bor-Ping Jang, Wei-Hung Lin, Chung-Shi Liu | 2013-10-15 |
| 8390651 | Driving method and driving apparatus for displaying apparatus | Yi-Cheng Tsai, Qi-Ming Lu, Jhen-Shen Liao, Kuan-Hung Liu | 2013-03-05 |
| 8381965 | Thermal compress bonding | Bor-Ping Jang, Wei-Hung Lin, Chung-Shi Liu | 2013-02-26 |
| 8360303 | Forming low stress joints using thermal compress bonding | Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu | 2013-01-29 |
| 8139191 | Pixel array structure | Chien-Kuo He | 2012-03-20 |
| 8111226 | Liquid crystal display device | Yi-Cheng Tsai | 2012-02-07 |
| 8054297 | Touch display panel | — | 2011-11-08 |