Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710646 | Fan-out packaging method and fan-out packaging plate | Chuan Hu, Yingqiang YAN, Yingjun Pi, Junjun Liu, Edward R. Prack | 2023-07-25 |
| 11616030 | Methods for making three-dimensional module | Guobiao ZHANG, Hongyu Yu, Shengming Zhou, Kai-Cheng Chen, Yida Li +1 more | 2023-03-28 |
| 11335664 | Integrated circuit packaging method and integrated packaging circuit | Chuan Hu, Junjun Liu, Edward R. Prack | 2022-05-17 |
| 11217542 | Three-dimensional module with integrated passive components | Guobiao ZHANG, Hongyu Yu, Shengming Zhou, Guoxing Zhang, Guangzhao Liu +2 more | 2022-01-04 |
| 11183458 | Integrated circuit packaging structure and method | Chuan Hu, Junjun Liu, Edward R. Prack | 2021-11-23 |
| 11170863 | Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) | Guobiao ZHANG, Yida Li, Xiaodong Xiang, Hongyu Yu, Shengming Zhou +5 more | 2021-11-09 |
| 10930634 | Integrated circuit system and packaging method therefor | Chuan Hu, Junjun Liu, Edward R. Prack | 2021-02-23 |
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Chuan Hu, Junjun Liu, Edward R. Prack | 2020-12-15 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Chuan Hu, Junjun Liu, Edward R. Prack | 2020-04-07 |