EP

Edward R. Prack

IN Intel: 25 patents #1,576 of 30,777Top 6%
FS Freeescale Semiconductor: 5 patents #628 of 3,767Top 20%
SC Shenzhen Xiuyuan Electronic Technology Co.: 4 patents #3 of 10Top 30%
Motorola: 1 patents #6,475 of 12,470Top 55%
📍 Phoenix, AZ: #120 of 6,660 inventorsTop 2%
🗺 Arizona: #683 of 32,909 inventorsTop 3%
Overall (All Time): #85,906 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
8404519 Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns Gregory M. Chrysler, Thomas Dory, James G. Maveety, Unnikrishnan Vadakkanmaruveedu 2013-03-26
8072062 Circuit device with at least partial packaging and method for forming George R. Leal, Jie Zhao, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more 2011-12-06
7971347 Method of interconnecting workpieces Leonel Arana, Rob Nickerson, Lim Chong Sim, Yoshihiro Tomita 2011-07-05
7964447 Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal Gregory M. Chrysler, Thomas Dory, James G. Maveety, Unnikrishnan Vadakkanmaruveedu 2011-06-21
7545030 Article having metal impregnated within carbon nanotube array Gregory M. Chrysler, Thomas Dory, James G. Maveety, Unnikrishnan Vadakkanmaruveedu 2009-06-09
7462551 Adhesive system for supporting thin silicon wafer Sudhakar N. Kulkarni, Leonel Arana 2008-12-09
7428138 Forming carbon nanotube capacitors Larry E. Mosley, James G. Maveety 2008-09-23
7361987 Circuit device with at least partial packaging and method for forming George R. Leal, Jie Zhao, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more 2008-04-22
6921975 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane George R. Leal, Jie Zhao, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more 2005-07-26
6888246 Semiconductor power device with shear stress compensation Lei Mercado, Vijay Sarihan, Young Sir Chung, James Jen-Ho Wang 2005-05-03
6838776 Circuit device with at least partial packaging and method for forming George R. Leal, Jie Zhao, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more 2005-01-04
6664200 Method of manufacturing a semiconductor component and polyimide etchant therefor Frank Fischer, Treliant Fang 2003-12-16
6646347 Semiconductor power device and method of formation Lei Mercado, Vijay Sarihan, Young Sir Chung, James Jen-Ho Wang 2003-11-11