Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818712 | Package with low stress region for an electronic component | Paige M. Holm | 2017-11-14 |
| 9548280 | Solder pad for semiconductor device package | Zhiwei Gong, Scott M. Hayes | 2017-01-17 |
| 9458012 | Method for shielding MEMS structures during front side wafer dicing | Alan J. Magnus | 2016-10-04 |
| 9359192 | Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication | Philip H. Bowles, Mamur Chowdhury | 2016-06-07 |
| 8148206 | Package for high power integrated circuits and method for forming | — | 2012-04-03 |
| 8080444 | Method for forming a packaged semiconductor device having a ground plane | — | 2011-12-20 |
| 7145084 | Radiation shielded module and method of shielding microelectronic device | Scott M. Hayes, Jinbang Tang | 2006-12-05 |
| 6930032 | Under bump metallurgy structural design for high reliability bumped packages | Owen R. Fay, Lizabeth Keser | 2005-08-16 |
| 6888246 | Semiconductor power device with shear stress compensation | Lei Mercado, Young Sir Chung, James Jen-Ho Wang, Edward R. Prack | 2005-05-03 |
| 6646347 | Semiconductor power device and method of formation | Lei Mercado, Young Sir Chung, James Jen-Ho Wang, Edward R. Prack | 2003-11-11 |
| 6309908 | Package for an electronic component and a method of making it | Lei Mercado | 2001-10-30 |
| 6077726 | Method and apparatus for stress relief in solder bump formation on a semiconductor device | Addi B. Mistry, James H. Kleffner, George F. Carney | 2000-06-20 |
| 5515735 | Micromachined flow sensor device using a pressure difference and method of manufacturing the same | — | 1996-05-14 |