Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7479407 | Digital and RF system and method therefor | John B. Gehman, Brian H. Christensen, Addi B. Mistry, David Patten, John K. Rohde +1 more | 2009-01-20 |
| 6815254 | Semiconductor package with multiple sides having package contacts | Addi B. Mistry, Joseph M. Haas, Dennis O. Kiffe, Daryl Wilde | 2004-11-09 |
| 6077726 | Method and apparatus for stress relief in solder bump formation on a semiconductor device | Addi B. Mistry, Vijay Sarihan, George F. Carney | 2000-06-20 |
| 5943597 | Bumped semiconductor device having a trench for stress relief | Addi B. Mistry | 1999-08-24 |