Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044494 | Stackable molded packages and methods of making the same | Marc Alan Mangrum, David Patten, Jesse Phou, Ziep Tran | 2011-10-25 |
| 7479407 | Digital and RF system and method therefor | John B. Gehman, Brian H. Christensen, James H. Kleffner, David Patten, John K. Rohde +1 more | 2009-01-20 |
| 7262615 | Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections | Edmond Cheng, David Patten | 2007-08-28 |
| 6815254 | Semiconductor package with multiple sides having package contacts | Joseph M. Haas, Dennis O. Kiffe, James H. Kleffner, Daryl Wilde | 2004-11-09 |
| 6429531 | Method and apparatus for manufacturing an interconnect structure | Rina Chowdhury, Scott K. Pozder, Deborah Hagen, Rebecca G. Cole, Kartik Ananthanarayanan +1 more | 2002-08-06 |
| 6077726 | Method and apparatus for stress relief in solder bump formation on a semiconductor device | Vijay Sarihan, James H. Kleffner, George F. Carney | 2000-06-20 |
| 5943597 | Bumped semiconductor device having a trench for stress relief | James H. Kleffner | 1999-08-24 |