Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429531 | Method and apparatus for manufacturing an interconnect structure | Addi B. Mistry, Scott K. Pozder, Deborah Hagen, Rebecca G. Cole, Kartik Ananthanarayanan +1 more | 2002-08-06 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Robert D. Mikkola, Matthew T. Herrick, Brett Baker, David Moralez Pena +4 more | 2001-10-02 |
| 6268289 | Method for protecting the edge exclusion of a semiconductor wafer from copper plating through use of an edge exclusion masking layer | Ajay Jain, Olubunmi O. Adetutu | 2001-07-31 |