Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10545196 | Multiple axis magnetic sensor | Lianjun Lu | 2020-01-28 |
| 10260981 | Pressure sensor having sense elements in multiple wheatstone bridges with chained outputs | Mark E. Schlarmann | 2019-04-16 |
| 10215653 | Signal interface circuit and pressure sensor system including same | Lianjun Liu | 2019-02-26 |
| 10145907 | Magnetic field sensor with permanent magnet biasing | Lianjun Liu | 2018-12-04 |
| 9933496 | Magnetic field sensor with multiple axis sense capability | Lianjun Liu | 2018-04-03 |
| 9897667 | Magnetic field sensor with permanent magnet biasing | Lianjun Liu | 2018-02-20 |
| 9857435 | Corruption detection and smart reset of ferromagnetic structures in magnetic field sensors | Lianjun Liu | 2018-01-02 |
| 9841469 | Magnetic field sensor with multiple sense layer magnetization orientations | Lianjun Liu | 2017-12-12 |
| 9818712 | Package with low stress region for an electronic component | Vijay Sarihan | 2017-11-14 |
| 9739842 | Magnetic field sensor with skewed sense magnetization of sense layer | Lianjun Liu | 2017-08-22 |
| 9720051 | Sensor package including a magnetic field sensor and a continuous coil structure for enabling z-axis self-test capability | Lianjun Liu | 2017-08-01 |
| 9664755 | Magnetic field sensor with structure for reconditioning magnetic polarization of flux guides | Lianjun Liu | 2017-05-30 |
| 9543067 | Magnetic pre-conditioning of magnetic sensors | Carlos M. Acuna, Mohammad A. Faruque, Kevin R. Fugate, Todd D. Hoffmann, Peter T. Jones +2 more | 2017-01-10 |
| 9318376 | Through substrate via with diffused conductive component | Lianjun Liu, Ruben B. Montez | 2016-04-19 |
| 9165886 | Sensor packaging method and sensor packages | Philip H. Bowles, Stephen R. Hooper, Raymond M. Roop | 2015-10-20 |
| 9046556 | Sensing device and related operating methods | Kevin R. Fugate, Edward W. Carstens, Dean W. Miller | 2015-06-02 |
| 9040355 | Sensor package and method of forming same | Philip H. Bowles, Stephen R. Hooper, Raymond M. Roop | 2015-05-26 |
| 9018029 | Vent hole sealing in multiple die sensor device | Philip H. Bowles, Stephen R. Hooper, Lianjun Liu, Raymond M. Roop | 2015-04-28 |
| 8659167 | Sensor packaging method and sensor packages | Philip H. Bowles, Stephen R. Hooper, Raymond M. Roop | 2014-02-25 |
| 7378346 | Integrated multi-wavelength Fabry-Perot filter and method of fabrication | Ngoc Le, Jeffrey H. Baker, Diana J. Convey, Steven M. Smith | 2008-05-27 |
| 7214999 | Integrated photoserver for CMOS imagers | Jon J. Candelaria | 2007-05-08 |
| 6984816 | Vertically integrated photosensor for CMOS imagers | Jon J. Candelaria | 2006-01-10 |
| 6965128 | Structure and method for fabricating semiconductor microresonator devices | Barbara Barenburg, Joyce K. Yamamoto, Fred V. Richard | 2005-11-15 |
| 6963061 | Orthogonal coupled transceiver | Fred V. Richard | 2005-11-08 |
| 6927432 | Vertically integrated photosensor for CMOS imagers | Jon J. Candelaria | 2005-08-09 |