Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10427929 | Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer | Colin Bryant Stevens | 2019-10-01 |
| 9988260 | Rough MEMS surface | Arvind S. Salian, Robert F. Steimle | 2018-06-05 |
| 9960081 | Method for selective etching using dry film photoresist | Colin Bryant Stevens, Lianjun Liu | 2018-05-01 |
| 9776853 | Reducing MEMS stiction by deposition of nanoclusters | Robert F. Steimle | 2017-10-03 |
| 9663356 | Etch release residue removal using anhydrous solution | Srivatsa Kundalgurki, Gary Pfeffer | 2017-05-30 |
| 9637372 | Bonded wafer structure having cavities with low pressure and method for forming | Robert F. Steimle, Aaron A. Geisberger, Jeffrey D. Hanna | 2017-05-02 |
| 9550664 | Reducing MEMS stiction by increasing surface roughness | Robert F. Steimle | 2017-01-24 |
| 9463973 | Reducing MEMS stiction by introduction of a carbon barrier | Robert F. Steimle | 2016-10-11 |
| 9458008 | Method of making a MEMS die having a MEMS device on a suspended structure | Chad S. Dawson, Fengyuan Li, Colin Bryant Stevens | 2016-10-04 |
| 9458010 | Systems and methods for anchoring components in MEMS semiconductor devices | Robert F. Steimle | 2016-10-04 |
| 9434602 | Reducing MEMS stiction by deposition of nanoclusters | Robert F. Steimle | 2016-09-06 |
| 9425115 | Glass frit wafer bond protective structure | Robert F. Steimle | 2016-08-23 |
| 9318376 | Through substrate via with diffused conductive component | Paige M. Holm, Lianjun Liu | 2016-04-19 |
| 9290380 | Reducing MEMS stiction by deposition of nanoclusters | Robert F. Steimle | 2016-03-22 |
| 9108842 | Reducing microelectromechanical systems stiction by formation of a silicon carbide layer | Michael D. Turner | 2015-08-18 |
| 8895339 | Reducing MEMS stiction by introduction of a carbon barrier | Robert F. Steimle | 2014-11-25 |
| 8633088 | Glass frit wafer bond protective structure | Robert F. Steimle | 2014-01-21 |
| 8592926 | Substrate bonding with metal germanium silicon material | Alex P. Pamatat | 2013-11-26 |
| 8455286 | Method of making a micro-electro-mechanical-systems (MEMS) device | Lisa H. Karlin, David W. Kierst, Lianjun Liu, Wei Liu, Robert F. Steimle | 2013-06-04 |
| 8058143 | Substrate bonding with metal germanium silicon material | Alex P. Pamatat | 2011-11-15 |
| 7943525 | Method of producing microelectromechanical device with isolated microstructures | Lisa Z. Zhang, Lisa H. Karlin, Woo Tae Park | 2011-05-17 |