Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9233836 | Semiconductor device including accelerometer devices | Hemant D. Desai, Kemiao Jia | 2016-01-12 |
| 9061885 | Cavity based packaging for MEMS devices | Lianjun Liu, Alex P. Pamatat, Paul M. Winebarger | 2015-06-23 |
| 8921203 | Method of forming an integrated circuit having varying substrate depth | Hemant D. Desai, Kemiao Jia | 2014-12-30 |
| 8652865 | Attaching a MEMS to a bonding wafer | Hemant D. Desai | 2014-02-18 |
| 8551814 | Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing | Lianjun Liu, Alex P. Pamatat, Paul M. Winebarger | 2013-10-08 |
| 8525316 | Eutectic flow containment in a semiconductor fabrication process | Hemant D. Desai | 2013-09-03 |
| 8461656 | Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS) | Woo Tae Park, Lianjun Liu, Heinz Loreck, Hemant D. Desai | 2013-06-11 |
| 8455286 | Method of making a micro-electro-mechanical-systems (MEMS) device | David W. Kierst, Lianjun Liu, Wei Liu, Ruben B. Montez, Robert F. Steimle | 2013-06-04 |
| 8138062 | Electrical coupling of wafer structures | Lianjun Liu, Alan J. Magnus | 2012-03-20 |
| 8119431 | Method of forming a micro-electromechanical system (MEMS) having a gap stop | Woo Tae Park, Lianjun Liu | 2012-02-21 |
| 8039312 | Method for forming a capped micro-electro-mechanical system (MEMS) device | Veera M. Gunturu, Shivcharan V. Kamaraju | 2011-10-18 |
| 7943525 | Method of producing microelectromechanical device with isolated microstructures | Lisa Z. Zhang, Ruben B. Montez, Woo Tae Park | 2011-05-17 |
| 7846815 | Eutectic flow containment in a semiconductor fabrication process | Hemant D. Desai | 2010-12-07 |