Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9061885 | Cavity based packaging for MEMS devices | Lisa H. Karlin, Lianjun Liu, Paul M. Winebarger | 2015-06-23 |
| 8592926 | Substrate bonding with metal germanium silicon material | Ruben B. Montez | 2013-11-26 |
| 8551814 | Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing | Lisa H. Karlin, Lianjun Liu, Paul M. Winebarger | 2013-10-08 |
| 8058143 | Substrate bonding with metal germanium silicon material | Ruben B. Montez | 2011-11-15 |
| 7892070 | Process of using a polishing apparatus including a platen window and a polishing pad | Brian E. Bottema, Stephen F. Abraham | 2011-02-22 |
| 7534162 | Grooved platen with channels or pathway to ambient air | Brian E. Bottema, Stephen F. Abraham | 2009-05-19 |
| 7520797 | Platen endpoint window with pressure relief | Brian E. Bottema, Stephen F. Abraham | 2009-04-21 |
| 7497763 | Polishing pad, a polishing apparatus, and a process for using the polishing pad | Brian E. Bottema, Stephen F. Abraham | 2009-03-03 |
| 7179151 | Polishing pad, a polishing apparatus, and a process for using the polishing pad | Brian E. Bottema, Stephen F. Abraham | 2007-02-20 |
| 7074118 | Polishing carrier head with a modified pressure profile | Brian E. Bottema, Keven A. Cline, Nathan R. Brown | 2006-07-11 |