Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450616 | Using a backside mask layer for forming a unique die mark identifier pattern | David Robert Currier, Darrell G. Hill, Fred Reece Clayton, Warren Crapse | 2022-09-20 |
| 10998231 | Method for increasing semiconductor device wafer strength | Colby Greg Rampley, Jason Wright, Jeffrey Lynn Weibrecht, Elijah Blue Foster | 2021-05-04 |
| 10340251 | Method for making an electronic component package | Jeffrey Lynn Weibrecht, Jason Wright, Colby Greg Rampley | 2019-07-02 |
| 10056360 | Localized redistribution layer structure for embedded component package and method | — | 2018-08-21 |
| 9997492 | Optically-masked microelectronic packages and methods for the fabrication thereof | Weng F. Yap, Scott M. Hayes | 2018-06-12 |
| 9691743 | Localized redistribution layer structure for embedded component package and method | — | 2017-06-27 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9458012 | Method for shielding MEMS structures during front side wafer dicing | Vijay Sarihan | 2016-10-04 |
| 9455216 | Semiconductor device package and method of manufacture | Dwight L. Daniels, Stephen R. Hooper, Justin E. Poarch | 2016-09-27 |
| 9401338 | Electronic devices with embedded die interconnect structures, and methods of manufacture thereof | Francisco Chaidez | 2016-07-26 |
| 9401339 | Wafer level packages having non-wettable solder collars and methods for the fabrication thereof | Weng F. Yap | 2016-07-26 |
| 9346671 | Shielding MEMS structures during wafer dicing | Chad S. Dawson, Stephen R. Hooper | 2016-05-24 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 9281286 | Microelectronic packages having texturized solder pads and methods for the fabrication thereof | Weng F. Yap | 2016-03-08 |
| 9093436 | Semiconductor device package and method of manufacture | Dwight L. Daniels, Stephen R. Hooper, Justin E. Poarch | 2015-07-28 |
| 9070669 | Wettable lead ends on a flat-pack no-lead microelectronic package | Dwight L. Daniels, Pamela A. O'Brien | 2015-06-30 |
| 8962389 | Microelectronic packages including patterned die attach material and methods for the fabrication thereof | William C. Stermer, Jr., Philip H. Bowles | 2015-02-24 |
| 8841758 | Semiconductor device package and method of manufacture | Dwight L. Daniels, Stephen R. Hooper, Justin E. Poarch | 2014-09-23 |
| 8822268 | Redistributed chip packages containing multiple components and methods for the fabrication thereof | — | 2014-09-02 |
| 8685790 | Semiconductor device package having backside contact and method for manufacturing | Carl E. D. Acosta, Douglas G. Mitchell, Justin E. Poarch | 2014-04-01 |
| 8138062 | Electrical coupling of wafer structures | Lianjun Liu, Lisa H. Karlin | 2012-03-20 |
| 7892950 | Methodology for processing a panel during semiconductor device fabrication | Justin E. Poarch, Jason Wright | 2011-02-22 |
| 7132303 | Stacked semiconductor device assembly and method for forming | James Jen-Ho Wang, Justin E. Poarch | 2006-11-07 |
| 6248664 | Method of forming a contact | Naresh Saha | 2001-06-19 |