Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9637372 | Bonded wafer structure having cavities with low pressure and method for forming | Robert F. Steimle, Aaron A. Geisberger, Ruben B. Montez | 2017-05-02 |
| 9418830 | Methods for bonding semiconductor wafers | Robert F. Steimle, Michael D. Turner | 2016-08-16 |