Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Sridhar Nara, Manohar S. Konchady, Suresh Yeruva +3 more | 2016-04-12 |
| 8952532 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Sridhar Nara, Manohar S. Konchady, Suresh Yeruva +3 more | 2015-02-10 |
| 6616261 | Automatic bi-directional alignment method and sensor for an ink jet printer | Christopher Alan Adkins, Adam Jude Ahne, Mark Joseph Edwards, Paul Harrington, Alexander Phillip Maroudis +1 more | 2003-09-09 |