TZ

Tieyu Zheng

IN Intel: 22 patents #1,785 of 30,777Top 6%
Overall (All Time): #195,586 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10198333 Test, validation, and debug architecture Mark B. Trobough, Keshavan Tiruvallur, Chinna Prudvi, Christian Iovin, David W. Grawrock +37 more 2019-02-05
9312237 Integrated circuit package with spatially varied solder resist opening dimension Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more 2016-04-12
8952532 Integrated circuit package with spatially varied solder resist opening dimension Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more 2015-02-10
8074354 Method of making a self-balanced dual L-shaped socket 2011-12-13
7695288 Land grid array (LGA) socket with cells and method of fabrication and assembly Xiaoqing Ma 2010-04-13
7677902 Extended package substrate James A. Irvine 2010-03-16
7604486 Lateral force countering load mechanism for LGA sockets Robert Martinson, Yupeng Li, Mandy G. Mistakawi, Thomas G. Ruttan 2009-10-20
7524199 Pick-and-place cap for socket assembly Xiaoqing Ma 2009-04-28
7497696 Socket for land grid array package Robert Martinson 2009-03-03
7479015 Socket assembly that includes improved contact arrangement Thomas G. Ruttan 2009-01-20
7429182 Socket assembly for securing socket body Xiaoqing Ma 2008-09-30
7419383 Self-balanced dual L-shaped socket 2008-09-02
7278859 Extended package substrate James A. Irvine 2007-10-09
7261572 Self-balanced land grid array socket 2007-08-28
7255494 Low-profile package for housing an optoelectronic assembly 2007-08-14
7255496 Package for housing an optoelectronic assembly Raghuram Narayan 2007-08-14
7227248 Stacked land grid array package 2007-06-05
7223629 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header Raghuram Narayan 2007-05-29
7201521 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header 2007-04-10
7176436 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header Eric Zbinden 2007-02-13
6992373 Stacked land grid array package 2006-01-31
6860652 Package for housing an optoelectronic assembly Raghuram Narayan 2005-03-01