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Integrated circuit package with spatially varied solder resist opening dimension |
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2011-12-13 |
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Xiaoqing Ma |
2010-04-13 |
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Extended package substrate |
James A. Irvine |
2010-03-16 |
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Robert Martinson, Yupeng Li, Mandy G. Mistakawi, Thomas G. Ruttan |
2009-10-20 |
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Xiaoqing Ma |
2009-04-28 |
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Socket for land grid array package |
Robert Martinson |
2009-03-03 |
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Thomas G. Ruttan |
2009-01-20 |
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Socket assembly for securing socket body |
Xiaoqing Ma |
2008-09-30 |
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Self-balanced dual L-shaped socket |
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2008-09-02 |
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Extended package substrate |
James A. Irvine |
2007-10-09 |
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2007-08-28 |
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2007-08-14 |
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Package for housing an optoelectronic assembly |
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2007-08-14 |
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2007-06-05 |
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2007-05-29 |
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Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
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2007-04-10 |
| 7176436 |
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
Eric Zbinden |
2007-02-13 |
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2006-01-31 |
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2005-03-01 |