Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more | 2016-04-12 |
| 8952532 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more | 2015-02-10 |