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Filter structure and filter device |
Jian Niu, Chengjie Zuo |
2025-12-16 |
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Resonance circuit and filtering device |
Wei-Jen Cheng, Lina Dai, Chengjie Zuo |
2025-12-09 |
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Semiconductor device package and methods of formation |
Tien-Chung Yang, Li-Hsien Huang, Mingshaw Wu, Yung-Chuan Liu, Chia-Yuan Chen |
2025-11-25 |
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Reduction of cracks in redistribution structure |
Tien-En Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Yinlung Lu |
2025-11-18 |
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| 12469807 |
Fan-out package structures with cascaded openings in enhancement layer |
Tien-En Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Yinlung Lu |
2025-11-11 |
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| 12413197 |
Band-pass filter circuit and multiplexer |
Xiaodong Wang, Chenggong He, Chengjie Zuo |
2025-09-09 |
|
| 12368428 |
3D filter circuit and 3D filter |
Xiaodong Wang, Chenggong He, Chengjie Zuo |
2025-07-22 |
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| 12354946 |
Delamination control of dielectric layers of integrated circuit chips |
Li-Hsien Huang, Yao-Chun Chuang, Chih-Lin Wang, Shih-Kang Tien |
2025-07-08 |
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| 12354941 |
Chip package structure and storage system |
Shu-Liang Ning, Jie Liu, Zhan Ying |
2025-07-08 |
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| 12349268 |
Package component |
Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu |
2025-07-01 |
|
| 12334632 |
Antenna assembly and communication system |
Kun Qin, Jian Niu, Chengjie Zuo |
2025-06-17 |
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| 12334465 |
Semiconductor package and method of forming same |
Li-Hsien Huang, Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin |
2025-06-17 |
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| 12328109 |
Filter circuit and electronic device |
Qilin SHI, Chengjie Zuo |
2025-06-10 |
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| 12322716 |
Heat dissipating features for laser drilling process |
Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more |
2025-06-03 |
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| 12313675 |
Method and device for wafer-level testing |
Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu |
2025-05-27 |
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Inflatable sofa |
— |
2025-04-29 |
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| 12270852 |
Method and system for wafer-level testing |
Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu |
2025-04-08 |
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| 12237226 |
Dicing method for stacked semiconductor devices |
Tsung-Hsing Lu, Li-Huan Chu, Pei-Haw Tsao |
2025-02-25 |
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| 12199352 |
Tuning circuit and communication device |
Lei Xu, Chengjie Zuo |
2025-01-14 |
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Injection mould and injection moulding method |
Jie Liu, Changhao Quan, Zhan Ying |
2025-01-07 |
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Semiconductor structure and manufacturing method of the same |
Ming-Te Chen, Hui-Ting Tsai, Kuo-Feng Yu, Chun Hsiung Tsai |
2024-12-17 |
$28,729,000 |
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Balun circuit structure and balun device |
Wei CHENG, Chengjie Zuo |
2024-10-29 |
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| 12131951 |
Semiconductor packaging method and semiconductor structure |
Chuxian Liao, Jie Liu, Lixia Zhang, Zhan Ying |
2024-10-29 |
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Chip inductor and method for manufacturing same |
Wei CHENG, Chengjie Zuo |
2024-09-17 |
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Method and device for wafer-level testing |
Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo, Yinlung Lu |
2024-08-20 |
$10,659,000 |
