Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Jun He, Li-Hsien Huang, Yao-Chun Chuang, Chih-Lin Wang | 2025-07-08 |
| 10269705 | Semiconductor structure and manufacturing method thereof | Kai Cheng, Ching-Kun Huang | 2019-04-23 |
| 9984967 | Semiconductor structure and manufacturing method thereof | Kai Cheng, Ching-Kun Huang | 2018-05-29 |