Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Li-Hsien Huang, Hsueh-Lung Cheng, Yao-Chun Chuang | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yao-Chun Chuang | 2025-08-05 |
| 12349268 | Package component | Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Jun He | 2025-07-01 |
| 12313675 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2025-05-27 |
| 12293959 | Through-circuit Vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2025-05-06 |
| 12270852 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2025-04-08 |
| 12243805 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2025-03-04 |
| 12066484 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2024-08-20 |
| 12025655 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2024-07-02 |
| 11924965 | Package component and forming method thereof | Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Jun He | 2024-03-05 |
| 11830832 | Semiconductor structure and manufacturing method thereof | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2023-11-28 |
| 11754621 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2023-09-12 |
| 11630149 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2023-04-18 |
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2023-03-28 |
| 11448692 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2022-09-20 |
| 11361141 | Method and system for manufacturing a semiconductor device | Hsuan-Ming Huang, An Shun Teng, Mingni Chang, Ming-Yih Wang | 2022-06-14 |
| 11309258 | Semiconductor structure | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2022-04-19 |
| 11073551 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2021-07-27 |
| 10957664 | Semiconductor structure and manufacturing method thereof | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2021-03-23 |
| 10726191 | Method and system for manufacturing a semiconductor device | Hsuan-Ming Huang, An Shun Teng, Mingni Chang, Ming-Yih Wang | 2020-07-28 |
| 10707179 | Semiconductor structure and method for forming the same | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2020-07-07 |