Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336173 | Anti-fuse one-time programmable nonvolatile memory cell and memory thereof | Teng-Feng Wang, Meifang Lee | 2025-06-17 |
| 12293959 | Through-circuit Vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Yinlung Lu | 2025-05-06 |
| 12262539 | 3D NAND memory device and method of forming the same | Yali Song, Li Xiao | 2025-03-25 |
| 12248022 | Method and apparatus for detecting defective logic devices | Chi-Che Wu, Tsung-Yang Hung, Jia GUO | 2025-03-11 |
| 12243805 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Yinlung Lu | 2025-03-04 |
| 12131992 | Semiconductor structure and method of manufacturing the same | Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Ming-Hong Hsieh, Mingni Chang | 2024-10-29 |
| 12014997 | Dummy stacked structures surrounding TSVs and method forming the same | Mingni Chang, Yun-Chin Tsou, Ching-Jing Wu, Shiou-Fan Chen | 2024-06-18 |
| 12007438 | Method and system for testing an integrated circuit | Chi-Che Wu, Tsung-Yang Hung | 2024-06-11 |
| 11963347 | One-time programmable memory device including anti-fuse element | Chiung-Ting Ou, Jian-Hong Lin | 2024-04-16 |
| 11852682 | Circuit screening system and circuit screening method | Chi-Che Wu, Tsung-Yang Hung, Jia GUO, Yi Fang | 2023-12-26 |
| 11830806 | Semiconductor structure and method of manufacturing the same | Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Ming-Hong Hsieh, Mingni Chang | 2023-11-28 |
| 11830832 | Semiconductor structure and manufacturing method thereof | Tung-Jiun Wu, Mingni Chang, Yinlung Lu | 2023-11-28 |
| 11825656 | 3D NAND memory device and method of forming the same | Yali Song, Li Xiao | 2023-11-21 |
| 11675004 | Method and apparatus for detecting defective logic devices | Chi-Che Wu, Tsung-Yang Hung, Jia GUO | 2023-06-13 |
| 11665890 | One-time programmable memory device including anti-fuse element and manufacturing method thereof | Chiung-Ting Ou, Jian-Hong Lin | 2023-05-30 |
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Yinlung Lu | 2023-03-28 |
| 11579191 | Method and system for testing an integrated circuit | Chi-Che Wu, Tsung-Yang Hung | 2023-02-14 |
| 11500016 | Circuit screening system and circuit screening method | Chi-Che Wu, Tsung-Yang Hung, Jia GUO, Edna Fang | 2022-11-15 |
| 11430811 | 3D NAND memory device with select gate cut | Yali Song, Li Xiao | 2022-08-30 |
| 11404441 | 3D NAND memory device and method of forming the same | Yali Song, Li Xiao | 2022-08-02 |
| 11361141 | Method and system for manufacturing a semiconductor device | Hsuan-Ming Huang, An Shun Teng, Mingni Chang, Yinlung Lu | 2022-06-14 |
| 11309258 | Semiconductor structure | Tung-Jiun Wu, Yinlung Lu, Mingni Chang | 2022-04-19 |
| 11199508 | Failure analysis method with improved detection accuracy for advanced technology node | Chi-Che Wu, Tsung-Yang Hung | 2021-12-14 |
| 11094702 | One-time programmable memory device including anti-fuse element and manufacturing method thereof | Chiung-Ting Ou, Jian-Hong Lin | 2021-08-17 |
| 11062782 | Three-dimensional memory device programming with reduced disturbance | Hong Liu, Yali Song | 2021-07-13 |