TW

Tung-Jiun Wu

TSMC: 23 patents #1,475 of 12,232Top 15%
Overall (All Time): #179,259 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
12374613 Semiconductor structure and method for manufacturing the same 2025-07-29
12368097 Contact structures for reducing electrical shorts and methods of forming the same 2025-07-22
12362272 Semiconductor structure and manufacturing method thereof 2025-07-15
12080752 Semiconductor structure and manufacturing method for the same 2024-09-03
11830832 Semiconductor structure and manufacturing method thereof Mingni Chang, Ming-Yih Wang, Yinlung Lu 2023-11-28
11776895 Semiconductor structure and method for manufacturing the same 2023-10-03
11764256 Semiconductor structure including MIM capacitor Shun-Yi Lee 2023-09-19
11715687 Contact structures for reducing electrical shorts and methods of forming the same 2023-08-01
11670579 Semiconductor structure and method of manufacturing the same 2023-06-06
11664306 Semiconductor structure and manufacturing method thereof 2023-05-30
11309258 Semiconductor structure Yinlung Lu, Mingni Chang, Ming-Yih Wang 2022-04-19
11127705 Semiconductor structure and manufacturing method thereof 2021-09-21
11063111 Semiconductor structure and manufacturing method for the same 2021-07-13
10957664 Semiconductor structure and manufacturing method thereof Mingni Chang, Ming-Yih Wang, Yinlung Lu 2021-03-23
10879206 Semiconductor structure and method for forming the same 2020-12-29
10872821 Semiconductor structure and manufacturing method thereof 2020-12-22
10867944 Semiconductor structure and manufacturing method thereof 2020-12-15
10840324 Semiconductor structure and manufacturing method for the same 2020-11-17
10825894 MIM capacitor and method of manufacturing the same Shun-Yi Lee 2020-11-03
10825765 Semiconductor structure and manufacturing method thereof 2020-11-03
10804230 Semiconductor package and method of manufacturing the same 2020-10-13
10707179 Semiconductor structure and method for forming the same Yinlung Lu, Mingni Chang, Ming-Yih Wang 2020-07-07
9711474 Semiconductor package structure with polymeric layer and manufacturing method thereof Gia-Her Lu, Liang-Chen Lin, Tung-Chin Yeh, Jyun-Lin Wu 2017-07-18