Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014252 | Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors | Shih-Cheng Chang, Liang-Chen Lin, Fu-Tsai Hou, Tung-Chin Yeh, Shih-Kai Lin +2 more | 2018-07-03 |
| 9711474 | Semiconductor package structure with polymeric layer and manufacturing method thereof | Liang-Chen Lin, Tung-Chin Yeh, Jyun-Lin Wu, Tung-Jiun Wu | 2017-07-18 |
| 9385079 | Methods for forming stacked capacitors with fuse protection | Shih-Cheng Chang, Liang-Chen Lin, Fu-Tsai Hou, Tung-Chin Yeh, Shih-Kai Lin +2 more | 2016-07-05 |