Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293959 | Through-circuit Vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Yih Wang, Yinlung Lu | 2025-05-06 |
| 12243805 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Yih Wang, Yinlung Lu | 2025-03-04 |
| 12154838 | Semiconductor arrangement and method of forming | Chih-Wei Lin, Ming-Hsien Lin, Jian-Hong Lin | 2024-11-26 |
| 12131992 | Semiconductor structure and method of manufacturing the same | Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Mingni Chang, Ming-Yih Wang | 2024-10-29 |
| 11830806 | Semiconductor structure and method of manufacturing the same | Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Mingni Chang, Ming-Yih Wang | 2023-11-28 |
| 11616002 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Yih Wang, Yinlung Lu | 2023-03-28 |
| 9875964 | Semiconductor device components and methods | Bi-Ling Lin, Jian-Hong Lin, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu | 2018-01-23 |
| 8648592 | Semiconductor device components and methods | Bi-Ling Lin, Jian-Hong Lin, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu | 2014-02-11 |
| 7436009 | Via structures and trench structures and dual damascene structures | Yi-Chen Huang, Chien-Chung Fu, Hui Ouyang, Yi-Nien Su, Hun-Jan Tao | 2008-10-14 |
| 7217663 | Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof | Yi-Chen Huang, Chien-Chung Fu, Hui Ouyang, Yi-Nien Su, Hun-Jan Tao | 2007-05-15 |
| 6999081 | Method and apparatus for displaying production data for improved manufacturing decision making | Kuo-Chen Lin | 2006-02-14 |
| 6974505 | Tool for cleaning substrates | Hsin-Ching Shih, Chun-Li Chou, Hong-J. Tao | 2005-12-13 |