Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7122484 | Process for removing organic materials during formation of a metal interconnect | Baw-Ching Perng, Yi-Chen Huang, Jun-Lung Huang, Bor-Wen Chan, Peng-Fu Hsu +2 more | 2006-10-17 |
| 6974505 | Tool for cleaning substrates | Chun-Li Chou, Ming-Hong Hsieh, Hong-J. Tao | 2005-12-13 |
| 6797627 | Dry-wet-dry solvent-free process after stop layer etch in dual damascene process | Yi-Nien Su, Li-Te Lin, Li-Chie Chiao | 2004-09-28 |