Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388028 | Package structure | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Jyun-Lin Wu, Yao-Chun Chuang, Yinlung Lu | 2025-08-05 |
| 12320610 | Cover kit for firearm handguard | Shanyao Lee | 2025-06-03 |
| 12308313 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2025-05-20 |
| 12237262 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2025-02-25 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Po-Hao Tsai +1 more | 2024-12-24 |
| 12051654 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2024-07-30 |
| 11901279 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11901277 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11848265 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2023-12-19 |
| 11804451 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2023-10-31 |
| 11656051 | Bipod grip for firearms | Shanyao Lee | 2023-05-23 |
| 11637054 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2023-04-25 |
| 11592261 | Adjustable multi-angle grip for firearms | Shanyao Lee | 2023-02-28 |
| 11430739 | Structure and formation method of package structure with fan-out structure | Po-Hao Tsai, Hsien-Wen Liu, Shin-Puu Jeng, Meng-Liang Lin, Shih-Yung PENG | 2022-08-30 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Po-Hao Tsai +1 more | 2022-08-30 |
| 11302650 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2022-04-12 |
| 11248867 | Modular magazine release for firearms | Shanyao Lee | 2022-02-15 |
| 11175108 | Modular bolt catch for firearms | Shanyao Lee | 2021-11-16 |
| 11175109 | Dual-finger operable safety selector for firearms | Shanyao Lee | 2021-11-16 |
| 11162758 | Adjustable multi-angle grip for firearms | Shanyao Lee | 2021-11-02 |
| 11164754 | Fan-out packages and methods of forming the same | Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang +2 more | 2021-11-02 |
| 11114311 | Chip package structure and method for forming the same | Po-Hao Tsai, Shin-Puu Jeng, Techi Wong | 2021-09-07 |
| 11094625 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2021-08-17 |