Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388026 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2025-08-12 |
| 12334444 | Semiconductor package structure and method for forming the same | Po-Hao Chang, Hung-Chuan Chen | 2025-06-17 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |
| 12183723 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, I-Hsuan Peng | 2024-12-31 |
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2024-11-12 |
| 12021031 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2024-06-25 |
| 11862578 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2024-01-02 |
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2023-12-26 |
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2023-11-28 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, I-Hsuan Peng | 2023-11-28 |
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Sheng-Liang Kuo, Tai-Yu Chen | 2023-08-15 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, I-Hsuan Peng | 2023-06-06 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2023-05-09 |
| 11508707 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, I-Hsuan Peng | 2022-11-22 |
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2022-10-11 |
| 11342267 | Semiconductor package structure and method for forming the same | Po-Hao Chang, Hung-Chuan Chen | 2022-05-24 |
| 11302592 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Sheng-Liang Kuo, Tai-Yu Chen | 2022-04-12 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2022-03-01 |
| 11222850 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2022-01-11 |
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2021-11-09 |
| 11075132 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Tzu-Jui Fang, Po-Yao Chuang | 2021-07-27 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2019-12-24 |
| 10354988 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Hsien-Wen Liu | 2019-07-16 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Tzu-Jui Fang | 2019-05-14 |