CY

Chiung-Han Yeh

TSMC: 41 patents #828 of 12,232Top 7%
📍 Tainan, TW: #108 of 4,566 inventorsTop 3%
Overall (All Time): #72,489 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 1–25 of 42 patents

Patent #TitleCo-InventorsDate
12426333 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2025-09-23
11581250 Package with metal-insulator-metal capacitor and method of manufacturing the same Shuo-Mao Chen, Der-Chyang Yeh 2023-02-14
11037861 Interconnect structure for package-on-package devices Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2021-06-15
11018241 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2021-05-25
10971441 Package with metal-insulator-metal capacitor and method of manufacturing the same Shuo-Mao Chen, Der-Chyang Yeh 2021-04-06
10658492 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2020-05-19
10515875 Interconnect structure for package-on-package devices Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2019-12-24
10475731 Package with metal-insulator-metal capacitor and method of manufacturing the same Shuo-Mao Chen, Der-Chyang Yeh 2019-11-12
10403736 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2019-09-03
10276484 Package with metal-insulator-metal capacitor and method of manufacturing the same Shuo-Mao Chen, Der-Chyang Yeh 2019-04-30
10269685 Interconnect structure for package-on-package devices Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2019-04-23
10153205 Package with metal-insulator-metal capacitor and method of manufacturing the same Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Der-Chyang Yeh 2018-12-11
10084061 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2018-09-25
9960106 Package with metal-insulator-metal capacitor and method of manufacturing the same Shuo-Mao Chen, Der-Chyang Yeh 2018-05-01
9929251 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2018-03-27
9922903 Interconnect structure for package-on-package devices and a method of fabricating Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2018-03-20
9679988 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2017-06-13
9460987 Interconnect structure for package-on-package devices and a method of fabricating Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2016-10-04
9455344 Integrated circuit metal gate structure having tapered profile Harry-Hak-Lay Chuang, Kong-Beng Thei, Ming-Yuan Wu, Mong-Song Liang 2016-09-27
9263511 Package with metal-insulator-metal capacitor and method of manufacturing the same Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Der-Chyang Yeh 2016-02-16
9263396 Photo alignment mark for a gate last process Chun-Liang Shen, Ming-Yuan Wu, Kong-Beng Thei, Harry-Hak-Lay Chuang 2016-02-16
9048222 Method of fabricating interconnect structure for package-on-package devices Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more 2015-06-02
9040381 Packages with passive devices and methods of forming the same Chen-Hua Yu, Shang-Yun Hou, Der-Chyang Yeh, Shuo-Mao Chen, Yi-Jou Lin 2015-05-26
8932951 Dishing-free gap-filling with multiple CMPs Ming-Yuan Wu, Kong-Beng Thei, Harry-Hak-Lay Chuang, Mong-Song Liang 2015-01-13
8890260 Polysilicon design for replacement gate technology Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more 2014-11-18