Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2024-11-12 |
| 11948895 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2024-04-02 |
| 11862578 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2024-01-02 |
| 11748549 | Method and apparatus for integrated circuit mask patterning | Chin-Min Huang, Bo-Han Chen, Cherng-Shyan Tsay, Chien-Wen Lai, Hua-Tai Lin +2 more | 2023-09-05 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2023-06-27 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2023-05-09 |
| 11621191 | Method for fabricating a semiconductor device | Yuan-Yen Lo, Ming-Jhih Kuo, Chien-Yuan Chen | 2023-04-04 |
| 11410936 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2022-08-09 |
| 11307643 | Power management system and power management method for computer system | Wei Wang, Chia-Neng Yang | 2022-04-19 |
| 11264337 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2022-03-01 |
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2021-11-09 |
| 10990744 | Method and apparatus for integrated circuit mask patterning | Chin-Min Huang, Bo-Han Chen, Cherng-Shyan Tsay, Chien-Wen Lai, Hua-Tai Lin +2 more | 2021-04-27 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | I-Hsuan Peng, Tzu-Hung Lin | 2021-01-26 |
| 10879119 | Method for fabricating a semiconductor device | Yuan-Yen Lo, Ming-Jhih Kuo, Chien-Yuan Chen | 2020-12-29 |
| 10852795 | Method for system power management and computing system thereof | Wei Wang | 2020-12-01 |
| 10784211 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2020-09-22 |
| 10497689 | Semiconductor package assembly and method for forming the same | I-Hsuan Peng, Tzu-Hung Lin | 2019-12-03 |
| 10410969 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2019-09-10 |
| 9870443 | Method and apparatus for integrated circuit mask patterning | Chin-Min Huang, Bo-Han Chen, Cherng-Shyan Tsay, Chien-Wen Lai, Hua-Tai Lin +2 more | 2018-01-16 |
| 9213233 | Photolithography scattering bar structure and method | Wei-Kuan Yu, Yen-Hsu Chu, Tsai-Ming Huang, Chin-Min Huang, Cherng-Shyan Tsay +2 more | 2015-12-15 |
| 9195134 | Method and apparatus for integrated circuit mask patterning | Chin-Min Huang, Bo-Han Chen, Lun-Wen Yeh, Shun-Shing Yang, Chern-Shyan Tsay +2 more | 2015-11-24 |
| 9026956 | Method of lithographic process evaluation | Wei-Kuan Yu, Tsai-Ming Huang, Chin-Min Huang, Cherng-Shyan Tsay, Chien-Wen Lai +2 more | 2015-05-05 |
| 8972912 | Structure for chip extension | Chin-Min Huang, Cherng-Shyan Tsay, Chien-Wen Lai, Kong-Beng Thei, Hua-Tai Lin +1 more | 2015-03-03 |
| 8972909 | OPC method with higher degree of freedom | Jau-Shian Liang, Wen-Chen Lu, Chin-Min Huang, Ming-Hui Chih, Cherng-Shyan Tsay +2 more | 2015-03-03 |