Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Po-Yao Chuang | 2025-01-14 |
| 11075132 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Po-Yao Chuang | 2021-07-27 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Yi-Jou Lin | 2019-05-14 |