Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334489 | Lthc as charging barrier in info package formation | Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2025-06-17 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng | 2024-07-23 |
| 11923353 | LTHC as charging barrier in info package formation | Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2024-03-05 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2023-09-12 |
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2022-11-01 |
| 11437361 | LTHC as charging barrier in InFO package formation | Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2022-08-02 |
| 11257797 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng | 2022-02-22 |
| 11217548 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2022-01-04 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng +2 more | 2021-12-14 |
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2021-10-12 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2020-12-15 |
| 10651111 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2020-05-12 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng | 2020-01-28 |
| 10522526 | LTHC as charging barrier in InFO package formation | Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2019-12-31 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2019-12-17 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2019-04-30 |
| 10163843 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-12-25 |
| 10090267 | Bump structure and method for forming the same | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-10-02 |
| 9997482 | Solder stud structure | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-06-12 |
| 9899296 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2018-02-20 |
| 9806046 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-10-31 |