Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217548 | Semiconductor device structure and manufacturing method | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2022-01-04 |
| 11145613 | Method for forming bump structure | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2021-10-12 |
| 10163843 | Semiconductor device structure and manufacturing method | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-12-25 |
| 10090267 | Bump structure and method for forming the same | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-10-02 |
| 9997482 | Solder stud structure | Yi-Chen Liu, Yung S. Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-06-12 |
| 9806046 | Semiconductor device structure and manufacturing method | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-10-31 |
| 9779969 | Package structure and manufacturing method | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-10-03 |
| 9735123 | Semiconductor device structure and manufacturing method | Yi-Chen Liu, Yung S. Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-08-15 |