Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401387 | Electronic module | Shih-Wen Lu, Po-Hsiang Tseng, Hsin-Han Lin, Ming-Lun Yu | 2025-08-26 |
| 12394735 | Shifting contact pad for reducing stress | Wei-Chun Pai, Cheng Wei Ho, Sheng-Huan Chiu | 2025-08-19 |
| 12354907 | Electron migration control in interconnect structures | Kai-Shiung Hsu, Ding-I Liu, Jyh-Nan Lin | 2025-07-08 |
| 12321095 | Microcapsule imaging system including non-photopolymerizable reactive diluent | Wei You, Rong-Chang Liang | 2025-06-03 |
| 12300743 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2025-05-13 |
| 12237415 | Method for fabricating semiconductor device | Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Yu-Shu Lin | 2025-02-25 |
| 12176297 | Semiconductor device package | Hao-Chih Hsieh, Tzu-Cheng Lin | 2024-12-24 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2024-07-30 |
| 12021134 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2024-06-25 |
| 11876551 | Electronic module | Shih-Wen Lu, Po-Hsiang Tseng, Hsin-Han Lin, Ming-Lun Yu | 2024-01-16 |
| 11769833 | Method for fabricating semiconductor device | Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Yu-Shu Lin | 2023-09-26 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2023-09-12 |
| 11587835 | Semiconductor device and method for fabricating the same | Tien-I Wu, Yu-Shu Lin | 2023-02-21 |
| 11545560 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2023-01-03 |
| 11495686 | Semiconductor device and method for fabricating the same | Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Yu-Shu Lin | 2022-11-08 |
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Yi-Jen Lai, Perre Kao | 2022-11-01 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2022-08-02 |
| 11302646 | Semiconductor device package | Hao-Chih Hsieh, Tzu-Cheng Lin | 2022-04-12 |
| 11264273 | Electron migration control in interconnect structures | Kai-Shiung Hsu, Ding-I Liu, Jyh-Nan Lin | 2022-03-01 |
| 11217548 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Hsi-Kuei Cheng | 2022-01-04 |
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Hsi-Kuei Cheng | 2021-10-12 |
| 11121254 | Transistor with strained superlattice as source/drain region | Bo-Shiun Chen, Chung-Ting Huang, Chi-Hsuan Tang, Jhong-Yi Huang, Guan-Ying Wu | 2021-09-14 |
| 11062953 | Semiconductor device and method for fabricating the same | Tien-I Wu, Yu-Shu Lin | 2021-07-13 |
| 10943991 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2021-03-09 |
| 10699433 | Liquid level detecting method and device using the same | Jia-Hao BAI, Tzu-Hang Huang, Cheng-Hsun Lin | 2020-06-30 |