Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406867 | Split valve air curtain | Jia Wei Xu, Yin-Bin Tseng, Chun-Sheng Wu | 2025-09-02 |
| 12354908 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Chia-Yu Wu, Ding-I Liu | 2025-07-08 |
| 12354907 | Electron migration control in interconnect structures | Chun-Jen Chen, Ding-I Liu, Jyh-Nan Lin | 2025-07-08 |
| 12148656 | Method of manufacturing semiconductor device and semiconductor devices | Hsiao-Min Chen, Jyh-Nan Lin, Ding-I Liu | 2024-11-19 |
| 12020947 | Method of manufacturing semiconductor devices and semiconductor devices | Hui HAN, Ding-I Liu, Yuh-Ta Fan | 2024-06-25 |
| 11967522 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Chia-Yu Wu, Ding-I Liu | 2024-04-23 |
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Hsiao-Min Chen, Jyh-Nan Lin, Ding-I Liu | 2022-05-03 |
| 11315829 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Chia-Yu Wu, Ding-I Liu | 2022-04-26 |
| 11264273 | Electron migration control in interconnect structures | Chun-Jen Chen, Ding-I Liu, Jyh-Nan Lin | 2022-03-01 |
| 11069534 | Method of manufacturing semiconductor devices and semiconductor devices | Hui HAN, Ding-I Liu, Yuh-Ta Fan | 2021-07-20 |
| 10978337 | Aluminum-containing layers and methods of forming the same | Jyh-Nan Lin, Mu-Min Hung, Ding-I Liu | 2021-04-13 |
| 10724140 | Thermal chemical vapor deposition system and operating method thereof | Yen-Chan Lo, Yi-Fang Lai, Po-Hsiung Leu, Ding-I Liu, Si-Wen Liao +4 more | 2020-07-28 |
| 10626499 | Deposition device structure | Yen-Chan Lo, Huan-Chieh Chen, Yi-Fang Lai, Keith Kuang-Kuo Koai, Chin-Feng Sun +2 more | 2020-04-21 |
| 10161041 | Thermal chemical vapor deposition system and operating method thereof | Yen-Chan Lo, Yi-Fang Lai, Po-Hsiung Leu, Ding-I Liu, Si-Wen Liao +4 more | 2018-12-25 |
| 9716044 | Interlayer dielectric structure with high aspect ratio process (HARP) | Jen-Chi Chang, Chun-Li Lin, Ming-Shiou Kuo, Wen-Long Lee, Po-Hsiung Leu +1 more | 2017-07-25 |