Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10864530 | Coating apparatus and method of forming coating film | Lan-Hai Wang, Yong-Hung Yang, Ding-I Liu, Si-Wen Liao, Mao-Cheng Lin | 2020-12-15 |
| 10867787 | Method for controlling plasma in semiconductor fabrication | Cheng-Tsung Wu, Ding-I Liu, Si-Wen Liao, Hsiang-Sheng Kung | 2020-12-15 |
| 10867838 | Semiconductor device having a shallow trench isolation structure and methods of forming the same | Chun-Li Lin, Yl-Fang Li, Geng-Shuoh Chang, Chun-Sheng Wu, Ding-I Liu | 2020-12-15 |
| 10724140 | Thermal chemical vapor deposition system and operating method thereof | Yen-Chan Lo, Yi-Fang Lai, Ding-I Liu, Si-Wen Liao, Kai-Shiung Hsu +4 more | 2020-07-28 |
| 10626499 | Deposition device structure | Yen-Chan Lo, Huan-Chieh Chen, Yi-Fang Lai, Keith Kuang-Kuo Koai, Chin-Feng Sun +2 more | 2020-04-21 |
| 10533252 | Showerhead, semicondcutor processing apparatus having the same and semiconductor process | Chih-Chiang Chiu, Ding-I Liu, Chin-Feng Lin | 2020-01-14 |
| 10395918 | Method and system for controlling plasma in semiconductor fabrication | Cheng-Tsung Wu, Ding-I Liu, Si-Wen Liao, Hsiang-Sheng Kung | 2019-08-27 |
| 10161041 | Thermal chemical vapor deposition system and operating method thereof | Yen-Chan Lo, Yi-Fang Lai, Ding-I Liu, Si-Wen Liao, Kai-Shiung Hsu +4 more | 2018-12-25 |
| 10164063 | Semiconductor structure with protection layer | Chih-Wei Chiang, Ding-I Liu | 2018-12-25 |
| 9953861 | Semiconductor device having a shallow trench isolation structure and methods of forming the same | Chun-Li Lin, Yi Li, Geng-Shuoh Chang, Chun-Sheng Wu, Ding-I Liu | 2018-04-24 |
| 9831307 | Gap fill self planarization on post EPI | Po-Chang Chen, Ding-I Liu | 2017-11-28 |
| 9716044 | Interlayer dielectric structure with high aspect ratio process (HARP) | Jen-Chi Chang, Chun-Li Lin, Kai-Shiung Hsu, Ming-Shiou Kuo, Wen-Long Lee +1 more | 2017-07-25 |
| 9631273 | Apparatus for dielectric deposition process | Lan-Hai Wang, Ding-I Liu, Si-Wen Liao, Yong-Hung Yang | 2017-04-25 |
| 9607809 | High density plasma reactor with multiple top coils | Chi-Ching Lo, Tzu-Chun LIN, Ding-I Liu, Jen-Chi Chang, Ho-Ta Chuang | 2017-03-28 |
| 9573144 | Coating apparatus and method of forming coating film | Lan-Hai Wang, Yong-Hung Yang, Ding-I Liu, Si-Wen Liao, Mao-Cheng Lin | 2017-02-21 |
| 9536771 | Gap fill self planarization on post EPI | Po-Chang Chen, Ding-I Liu | 2017-01-03 |
| 9356120 | Metal gate transistor and method for tuning metal gate profile | Po-Chi Wu, Buh-Kuan Fang, Yung-Jung Chang | 2016-05-31 |
| 9324559 | Thin film deposition apparatus with multi chamber design and film deposition methods | Lan-Hai Wang, Ding-I Liu, Si-Wen Liao, Yong-Hung Yang, Chia-Ming Tai | 2016-04-26 |
| 9209071 | Semiconductor structure with anti-etch structure in via and method for manufacturing the same | Geng-Shuoh Chang, Chun-Sheng Wu, Chun-Li Lin, Yi Li, Ding-I Liu | 2015-12-08 |
| 9048185 | Profile pre-shaping for replacement poly gate interlayer dielectric | Chih-Wei Chiang, Kuang-Cheng Wu, Wen-Long Lee, Ding-I Liu | 2015-06-02 |
| 8946095 | Method of forming interlayer dielectric film above metal gate of semiconductor device | Li-Jui Chen, Jyh-Nan Lin, Chin-Feng Sun, Ding-I Liu | 2015-02-03 |
| 8803249 | Profile pre-shaping for replacement poly gate interlayer dielectric | Chih-Wei Chiang, Kuang-Cheng Wu, Wen-Long Lee, Ding-I Liu | 2014-08-12 |
| 6897147 | Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation | Shin-Yeu Tsai, Chia-Ming Yang, Tsang-Yu Liu, Yun-Da Fan, Chen-Peng Fan | 2005-05-24 |