Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354908 | Amorphous layers for reducing copper diffusion and method forming same | Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu | 2025-07-08 |
| 12354907 | Electron migration control in interconnect structures | Chun-Jen Chen, Kai-Shiung Hsu, Ding-I Liu | 2025-07-08 |
| 12148656 | Method of manufacturing semiconductor device and semiconductor devices | Hsiao-Min Chen, Kai-Shiung Hsu, Ding-I Liu | 2024-11-19 |
| 11967522 | Amorphous layers for reducing copper diffusion and method forming same | Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu | 2024-04-23 |
| 11742393 | Semiconductor device having a multi-layer diffusion barrier and method of making the same | Ding-I Liu, Yuh-Ta Fan | 2023-08-29 |
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Hsiao-Min Chen, Kai-Shiung Hsu, Ding-I Liu | 2022-05-03 |
| 11315829 | Amorphous layers for reducing copper diffusion and method forming same | Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu | 2022-04-26 |
| 11264467 | Semiconductor device having multi-layer diffusion barrier and method of making the same | Ding-I Liu, Yuh-Ta Fan | 2022-03-01 |
| 11264273 | Electron migration control in interconnect structures | Chun-Jen Chen, Kai-Shiung Hsu, Ding-I Liu | 2022-03-01 |
| 10978337 | Aluminum-containing layers and methods of forming the same | Mu-Min Hung, Kai-Shiung Hsu, Ding-I Liu | 2021-04-13 |
| 10749004 | Semiconductor device having a multi-layer diffusion barrier | Ding-I Liu, Yuh-Ta Fan | 2020-08-18 |
| 10373906 | Structure and formation method of interconnection structure of semiconductor device | Tsung-Dar Lee, Li-Jui Chen | 2019-08-06 |
| 8946095 | Method of forming interlayer dielectric film above metal gate of semiconductor device | Li-Jui Chen, Chin-Feng Sun, Po-Hsiung Leu, Ding-I Liu | 2015-02-03 |