Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020905 | Method of using high density plasma chemical vapor deposition chamber | Wei Wu, Ding-I Liu | 2024-06-25 |
| 11342164 | High density plasma chemical vapor deposition chamber and method of using | Wei Wu, Ding-I Liu | 2022-05-24 |
| 10910199 | Method of controlling an adjustable nozzle and method of making a semiconductor device | Wei Wu, Ding-I Liu | 2021-02-02 |
| 9941100 | Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzle | Wei Wu, Ding-I Liu | 2018-04-10 |
| 9859137 | Substrate heat treatment apparatus and heat treatment method | Chun-Cha Kuo, Tzu-Chien Cheng, Ding-I Liu | 2018-01-02 |
| 9716044 | Interlayer dielectric structure with high aspect ratio process (HARP) | Jen-Chi Chang, Chun-Li Lin, Kai-Shiung Hsu, Ming-Shiou Kuo, Po-Hsiung Leu +1 more | 2017-07-25 |
| 9349733 | Gate structure having spacer with flat top surface and method for forming the same | Jen-Chi Chang | 2016-05-24 |
| 9048185 | Profile pre-shaping for replacement poly gate interlayer dielectric | Chih-Wei Chiang, Kuang-Cheng Wu, Po-Hsiung Leu, Ding-I Liu | 2015-06-02 |
| 8803249 | Profile pre-shaping for replacement poly gate interlayer dielectric | Chih-Wei Chiang, Kuang-Cheng Wu, Po-Hsiung Leu, Ding-I Liu | 2014-08-12 |
| 7851358 | Low temperature method for minimizing copper hillock defects | Jun Wu, Chyi-Tsong Ni, Shih-Chi Lin | 2010-12-14 |
| 7635651 | Method of smoothening dielectric layer | Jun Wu, Shih-Chi Lin, Chyi-Tsong Ni | 2009-12-22 |
| 7611589 | Methods of spin-on wafer cleaning | Jun Wu, Dong Lu, Shih-Chi Lin, Yi-An Jian, Guang-Cheng Wang +4 more | 2009-11-03 |
| 7368383 | Hillock reduction in copper films | Shih-Chi Lin, Francis Wang, Sez-An Wu | 2008-05-06 |
| 6585826 | Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles | Yali Tai, Shih-Chi Lin, Francis Wang, Szu-An Wu, Hsi-Kuei Cheng +1 more | 2003-07-01 |