Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7368383 | Hillock reduction in copper films | Shih-Chi Lin, Francis Wang, Wen-Long Lee | 2008-05-06 |
| 6713407 | Method of forming a metal nitride layer over exposed copper | Yi-Lung Cheng, Wen-Kung Cheng, Yi-Lung Wang, Shin-Chi Lin | 2004-03-30 |