Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7646207 | Method for measuring a property of interconnections and structure for the same | Jian-Hong Lin, Chin Chuan Peng, Shou-Chung Lee, Chien-Jung Wang, Chien Shih Tsai +1 more | 2010-01-12 |
| 7512924 | Semiconductor device structure and methods of manufacturing the same | Hsien-Wei Chen, Hsueh-Chung Chen, Shin-Puu Jeng | 2009-03-31 |
| 7470584 | TEOS deposition method | Hong-Jui Chang, Ying-Lang Wang | 2008-12-30 |
| 7449911 | Method for determining electro-migration failure mode | Bi-Ling Liu, Chin-Chuang Peng, Chien Shih Tsai, Hway-Chi Lin | 2008-11-11 |
| 7420277 | System for heat dissipation in semiconductor devices | Hsien-Wei Chen, Jiun-Lin Yeh, Shin-Puu Jeng | 2008-09-02 |
| 7296532 | Bypass gas feed system and method to improve reactant gas flow and film deposition | Mo-Chen Liao, Eric Tsai, Sze-Au Wu, Ying-Lung Wang | 2007-11-20 |
| 7253121 | Method for forming IMD films | Miao-Cheng Liao, Ying-Lang Wang | 2007-08-07 |
| 7208415 | Plasma treatment method for electromigration reduction | Jane-Bai Lai | 2007-04-24 |
| 7176571 | Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure | Ying-Lung Wang | 2007-02-13 |
| 7157367 | Device structure having enhanced surface adhesion and failure mode analysis | Hway-Chi Lin, Chao-Hsiung Wang | 2007-01-02 |
| 7125802 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2006-10-24 |
| 7078336 | Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current | Ying-Lang Wang | 2006-07-18 |
| 7074701 | Method of forming a borderless contact opening featuring a composite tri-layer etch stop material | Shih-Chia Cheng | 2006-07-11 |
| 6979656 | Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same | Shiu-Ko JangJian, Jun Wu, Chi-Wen Liu, Ying-Lung Wang, Michael Chang +1 more | 2005-12-27 |
| 6903019 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2005-06-07 |
| 6815072 | Method to solve particle performance of FSG layer by using UFU season film for FSG process | Ming-Hwa Yoo, Szu-An Wu, Ying-Lang Wang | 2004-11-09 |
| 6815007 | Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film | Ming-Hwa Yoo, Shih-Chi Lin, Szu-An Wu, Ying-Lang Wang | 2004-11-09 |
| 6802935 | Semiconductor chamber process apparatus and method | Hui-Chi Lin, Szu-An Wu, Ying-Lang Wang | 2004-10-12 |
| 6790778 | Method for capping over a copper layer | Ying-Lang Wang, We-Li Chen | 2004-09-14 |
| 6759347 | Method of forming in-situ SRO HDP-CVD barrier film | Ming-Hwa Yoo, Sze-An Wu, Ying-Lung Wang | 2004-07-06 |
| 6713407 | Method of forming a metal nitride layer over exposed copper | Wen-Kung Cheng, Sez-An Wu, Yi-Lung Wang, Shin-Chi Lin | 2004-03-30 |
| 6703317 | Method to neutralize charge imbalance following a wafer cleaning process | Ming-Hwa Yoo, Sze-An Wu, Ying-Lung Wang | 2004-03-09 |
| 6660638 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2003-12-09 |
| 6602560 | Method for removing residual fluorine in HDP-CVD chamber | Wen-Kung Cheng, Ming-Hwa Yoo, Szu-An Wu, Ying-Long Wang, Pei-Fen Chou | 2003-08-05 |
| 6584987 | Method for improved cleaning in HDP-CVD process with reduced NF3 usage | Chun-Ching Tsan, Wen-Kung Cheng, Yin-Lang Wang | 2003-07-01 |