Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798860 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao | 2023-10-24 |
| 11037849 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao | 2021-06-15 |
| 10475719 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao | 2019-11-12 |
| 10211202 | Method of forming bandgap reference integrated circuit | Chewn-Pu Jou | 2019-02-19 |
| 10020239 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao | 2018-07-10 |
| 9972995 | Circuit with a droop compensating mechanism | Chewn-Pu Jou, Huan-Neng Chen | 2018-05-15 |
| 9876008 | Bandgap reference circuit | Chewn-Pu Jou | 2018-01-23 |
| 9502886 | MiM capacitor | Huan-Neng Chen, Chewn-Pu Jou, Chwei-Ching Chiu | 2016-11-22 |
| 9425330 | Metal oxide metal capacitor with slot vias | Chin-Shan Wang, Jian-Hong Lin | 2016-08-23 |
| 8785323 | Method of forming an interconnect structure having an enlarged region | — | 2014-07-22 |
| 8729705 | Seal ring structures with reduced moisture-induced reliability degradation | Jian-Hong Lin | 2014-05-20 |
| 8674508 | Seal ring structures with reduced moisture-induced reliability degradation | Jian-Hong Lin | 2014-03-18 |
| 8513115 | Method of forming an interconnect structure having an enlarged region | — | 2013-08-20 |
| 8379365 | Metal oxide metal capacitor with slot vias | Chin-Shan Wang, Jian-Hong Lin | 2013-02-19 |
| 8227923 | Interconnect structure to reduce stress induced voiding effect | — | 2012-07-24 |
| 8013451 | Interconnect structure to reduce stress induced voiding effect | — | 2011-09-06 |
| 7893459 | Seal ring structures with reduced moisture-induced reliability degradation | Jian-Hong Lin | 2011-02-22 |
| 7851793 | Test structure with TDDB test pattern | Ming-Zong Lin | 2010-12-14 |
| 7646207 | Method for measuring a property of interconnections and structure for the same | Jian-Hong Lin, Chin Chuan Peng, Shou-Chung Lee, Chien Shih Tsai, Bi-Ling Lin +1 more | 2010-01-12 |
| 7504731 | Interconnect structure to reduce stress induced voiding effect | — | 2009-03-17 |
| 7485912 | Flexible metal-oxide-metal capacitor design | — | 2009-02-03 |
| 7301239 | Wiring structure to minimize stress induced void formation | Su Chen Fan, Ding-Da Hu, Hsueh-Chung Chen | 2007-11-27 |
| 7227266 | Interconnect structure to reduce stress induced voiding effect | — | 2007-06-05 |
| 7157925 | Test structure for speeding a stress-induced voiding test and method of using same | — | 2007-01-02 |
| 6934206 | Test structure for detecting bridging of DRAM capacitors | — | 2005-08-23 |