Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208415 | Plasma treatment method for electromigration reduction | Yi-Lung Cheng | 2007-04-24 |
| 6780783 | Method of wet etching low dielectric constant materials | Pei-Fen Chou | 2004-08-24 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Chung-Shi Liu | 2004-06-22 |
| 6660655 | Method and solution for preparing SEM samples for low-K materials | — | 2003-12-09 |
| 6423625 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Chung-Shi Liu | 2002-07-23 |
| 6399487 | Method of reducing phase transition temperature by using silicon-germanium alloys | Lih-Juan Chen, Chung-Shi Liu, Chen-Hua Yu | 2002-06-04 |
| 6136680 | Methods to improve copper-fluorinated silica glass interconnects | Chung-Shi Liu, Tien-I Bao, Syun-Ming Jang, Chung-Long Chang, Hui Wang +4 more | 2000-10-24 |
| 6083829 | Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion promoter between copper and tin layers | Lih-Juann Chen, Chung-Shi Liu, Chen-Hua Yu | 2000-07-04 |
| 6015749 | Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure | Chung-Shi Liu, Chen-Hua Yu, Lih-Juann Chen | 2000-01-18 |