Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2022-11-01 |
| 10651111 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2020-05-12 |
| 9899296 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2018-02-20 |
| 8941232 | Metal bumps for cooling device connection | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2015-01-27 |