Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Chen-Shien Chen | 2024-07-16 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue | 2024-02-20 |
| 11329008 | Method for manufacturing semiconductor package for warpage control | Chen-Shien Chen, Ming-Da Cheng, Ming-Chih Yew | 2022-05-10 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2020-12-15 |
| 10797005 | Semiconductor package and method for manufacturing the same | Chen-Shien Chen, Ming-Da Cheng, Ming-Chih Yew | 2020-10-06 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2019-12-17 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2019-04-30 |