Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9779969 | Package structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-10-03 |
| 9735123 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2017-08-15 |
| 9594096 | Probe card for simultaneously testing multiple dies | You-Hua Chou | 2017-03-14 |
| 9190347 | Die edge contacts for semiconductor devices | You-Hua Chou, Hon-Lin Huang, Huai-Tei Yang | 2015-11-17 |
| 8952534 | Semiconductor device and semiconductor assembly with lead-free solder | Chih-Kang Han, Chien-Pin Chan, Chih-Yuan Chien, Huai-Tei Yang | 2015-02-10 |
| 8941232 | Metal bumps for cooling device connection | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2015-01-27 |
| 8916969 | Semiconductor devices, packaging methods and structures | Yu-Ren Chen, Ming Hung Tseng | 2014-12-23 |
| 8610270 | Semiconductor device and semiconductor assembly with lead-free solder | Chih-Kang Han, Chien-Pin Chan, Chih-Yuan Chien, Huai-Tei Yang | 2013-12-17 |
| 8564319 | Probe card for simultaneously testing multiple dies | You-Hua Chou | 2013-10-22 |
| 8541262 | Die edge contacts for semiconductor devices | You-Hua Chou, Hon-Lin Huang, Huai-Tei Yang | 2013-09-24 |