Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12211782 | Semiconductor package dielectric susbtrate including a trench | Yueh-Ting Lin, Ming-Shih Yeh, Der-Chyang Yeh | 2025-01-28 |
| 12159853 | Package structure including IPD and method of forming the same | Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Li-Hsien Huang, Yu-Hsiang Hu | 2024-05-14 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Yueh-Ting Lin, Ming-Shih Yeh, Der-Chyang Yeh | 2024-04-16 |
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Li-Hsien Huang, Yu-Hsiang Hu | 2023-06-20 |
| 11587900 | Package structure including IPD and method of forming the same | Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Ming-Chih Yew +2 more | 2021-12-14 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Li-Hsien Huang, Yu-Hsiang Hu | 2021-08-10 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2021-03-16 |
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-29 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Yueh-Ting Lin, Ming-Shih Yeh | 2020-08-25 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2020-01-21 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Li-Hui Cheng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10037973 | Method for manufacturing semiconductor package structure | Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2018-07-31 |
| 9793246 | Pop devices and methods of forming the same | An-Jhih Su, Hsien-Wei Chen, Li-Hsien Huang, Tien-Chung Yang | 2017-10-17 |
| 9406629 | Semiconductor package structure and manufacturing method thereof | Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2016-08-02 |