Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Tien-Chung Yang +1 more | 2019-04-30 |
| 10177032 | Devices, packaging devices, and methods of packaging semiconductor devices | Hsien-Wei Chen, An-Jhih Su | 2019-01-08 |
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen, Wei-Yu Chen | 2018-04-10 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2018-03-20 |
| 9659878 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2017-05-23 |