Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin | 2025-09-30 |
| 12368280 | Semiconductor device and method | Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh +1 more | 2025-07-22 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2025-07-01 |
| 12341104 | Methods of manufacturing semiconductor devices | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan | 2025-06-24 |
| 12211782 | Semiconductor package dielectric susbtrate including a trench | Yueh-Ting Lin, Hua-Wei Tseng, Der-Chyang Yeh | 2025-01-28 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su +1 more | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-11-12 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin | 2024-08-13 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2024-07-09 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2024-04-16 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Yueh-Ting Lin, Hua-Wei Tseng, Der-Chyang Yeh | 2024-04-16 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan | 2024-03-19 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2023-12-26 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2023-12-05 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2023-08-15 |
| 11682654 | Semiconductor structure having a sensor device and method of manufacturing the same | Der-Chyang Yeh, Li-Hsien Huang, Ta-Hsuan Lin | 2023-06-20 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su +1 more | 2023-02-21 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2022-11-15 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2022-10-25 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-10-11 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan | 2022-09-20 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2022-09-13 |