Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2022-09-13 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2022-01-04 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng +2 more | 2021-12-14 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, Yueh-Ting Lin, An-Jhih Su, Der-Chyang Yeh | 2021-11-16 |
| 11145633 | Semiconductor package and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Tien-Chung Yang | 2021-10-12 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin | 2021-07-27 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2021-07-13 |
| 10992100 | Semiconductor device and method | Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh +1 more | 2021-04-27 |
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang | 2020-12-29 |
| 10872855 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2020-12-22 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin | 2020-12-15 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Yueh-Ting Lin | 2020-08-25 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2020-04-28 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2020-04-14 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2020-01-07 |
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng +2 more | 2019-05-14 |
| 10163803 | Integrated fan-out packages and methods of forming the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2018-12-25 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-12-18 |