Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224643 | Structure and method for tunable interconnect scheme | Chung-Ju Lee, Tien-I Bao, Hai-Ching Chen, Shau-Lin Shue | 2015-12-29 |
| 8987085 | Methods for improving uniformity of cap layers | Chen-Hua Yu, Chih-Hsien Lin, Yung-Cheng Lu, Hui-Lin Chang | 2015-03-24 |
| 8623760 | Process for improving copper line cap formation | Chien-Hsueh Shih, Minghsing Tsai, Chen-Hua Yu | 2014-01-07 |
| 8432040 | Interconnection structure design for low RC delay and leakage | Chen-Hua Yu | 2013-04-30 |
| 8193087 | Process for improving copper line cap formation | Chien-Hsueh Shih, Minghsing Tsai, Chen-Hua Yu | 2012-06-05 |
| 8109407 | Apparatus for storing substrates | Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Jui-Pin Hung | 2012-02-07 |
| 8106512 | Low resistance high reliability contact via and metal line structure for semiconductor device | Hsiang-Huan Lee, Ming-Han Lee, Chen-Hua Yu, Shau-Lin Shue | 2012-01-31 |
| 8053865 | MOM capacitors integrated with air-gaps | Chung-Long Chang, Chia-Yi Chen, David Lu | 2011-11-08 |
| 8013445 | Low resistance high reliability contact via and metal line structure for semiconductor device | Hsiang-Huan Lee, Ming-Han Lee, Chen-Hua Yu | 2011-09-06 |
| 7651943 | Forming diffusion barriers by annealing copper alloy layers | Chen-Hua Yu, Ming-Han Lee | 2010-01-26 |
| 7354856 | Method for forming dual damascene structures with tapered via portions and improved performance | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2008-04-08 |
| 7179732 | Interconnection structure and fabrication method thereof | Chiung-Sheng Hsiung, Chih-Chao Yang, Gwo-Shil Yang, Jen-Kon Chen | 2007-02-20 |
| 6890851 | Interconnection structure and fabrication method thereof | Chiung-Sheng Hsiung, Chih-Chao Yang, Gwo-Shil Yang, Jen-Kon Chen | 2005-05-10 |