Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356220 | Telecommunications network predictions based on machine learning using aggregated network key performance indicators | Lance Paul Lukens, Shawn Derek Wallace, Farhana Sharmin Munnee, Daqi Li | 2025-07-08 |
| 11848843 | Network anomaly detection using machine learning models | Lance Paul Lukens, Shawn Derek Wallace, Piradee Nganrungruang | 2023-12-19 |
| 11844134 | Cell site repair part prediction machine learning system | Diksha Agarwal, Lance Paul Lukens, Daqi Li, Leland John Garris, Wayne Thompson | 2023-12-12 |
| 10051506 | Traffic management in wireless networks | Hetal J. Mistry, Rashmi Kumar, James W. Paine, Cliff Grimes, Ajay Patel | 2018-08-14 |
| 9385034 | Carbonization of metal caps | Ting-Yu Shen, Yung-Cheng Lu | 2016-07-05 |
| 9219036 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2015-12-22 |
| 8999842 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2015-04-07 |
| 8987085 | Methods for improving uniformity of cap layers | Chen-Hua Yu, Ming-Shih Yeh, Chih-Hsien Lin, Yung-Cheng Lu | 2015-03-24 |
| 8785324 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2014-07-22 |
| 8330275 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2012-12-11 |
| 8264046 | Synergy effect of alloying materials in interconnect structures | Yung-Cheng Lu, Syun-Ming Jang | 2012-09-11 |
| 8158521 | Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties | Chung-Chi Ko, Tien-I Bao, Yun-Chen Lu | 2012-04-17 |
| 8143162 | Interconnect structure having a silicide/germanide cap layer | Chen-Hua Yu, Yung-Cheng Lu, Ting-Yu Shen, Hung Chun Tsai | 2012-03-27 |
| 8053356 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2011-11-08 |
| 7977791 | Selective formation of boron-containing metal cap pre-layer | Yung-Cheng Lu, Syun-Ming Jang | 2011-07-12 |
| 7897505 | Method for enhancing adhesion between layers in BEOL fabrication | Chung-Chi Ko, Lih-Ping Li, Yung-Cheng Lu, Chih-Hsien Lin | 2011-03-01 |
| 7834458 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2010-11-16 |
| 7655556 | Interconnect structures for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2010-02-02 |
| 7642189 | Synergy effect of alloying materials in interconnect structures | Yung-Cheng Lu, Syun-Ming Jang | 2010-01-05 |
| 7629273 | Method for modulating stresses of a contact etch stop layer | Chen-Hua Yu, Hung Chun Tsai, Ting-Yu Shen, Yung-Cheng Lu | 2009-12-08 |
| 7456093 | Method for improving a semiconductor device delamination resistance | Pi-Tsung Chen, Keng-Chu Lin, Lih-Ping Li, Tien-I Bao, Yung-Cheng Lu +1 more | 2008-11-25 |
| 7352053 | Insulating layer having decreased dielectric constant and increased hardness | — | 2008-04-01 |
| 7312531 | Semiconductor device and fabrication method thereof | Yung-Cheng Lu, Chung-Chi Ko, Pi-Tsung Chen, Shau-Lin Shue, Chien-Hsueh Shih +2 more | 2007-12-25 |
| 7250370 | Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties | Chung-Chi Ko, Tien-I Bao, Yun-Chen Lu | 2007-07-31 |
| 7129164 | Method for forming a multi-layer low-K dual damascene | Yung-Cheng Lu, Li Li, Tien-I Bao, Chih-Hsien Lin | 2006-10-31 |