Issued Patents All Time
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7094705 | Multi-step plasma treatment method to improve CU interconnect electrical performance | Keng-Chu Lin, I-I Chen, Yung-Chen Lu, Syun-Ming Jeng | 2006-08-22 |
HC
Hui-Lin Chang
T-Mobile Innovations: 3 patents #114 of 460Top 25%
Sprint Spectrum: 1 patents #469 of 810Top 60%
Overall (All Time): #150,815 of 4,157,543Top 4%
26
Patents All Time